Items where Author is "Chu, D."
Group by: Item Type | No Grouping Jump to: Article | Conference or Workshop Item Number of items: 3. ArticleJoshi, K. ; Hung, S. ; Mukhopadhyay, S. ; Sato, T. ; Bevan, M. ; Rajamohanan, B. ; Wei, A. ; Noori, A. ; McDougall, B. ; Ni, C. ; Lazik, C. ; Saheli, G. ; Liu, P. ; Chu, D. ; Date, L. ; Datta, S. ; Brand, A. ; Swenberg, J. ; Mahapatra, S. (2013) Scaled gate stacks for sub-20-nm CMOS logic applications through integration of thermal IL and ALD HfOx IEEE Electron Device Letters, 34 (1). pp. 3-5. ISSN 0741-3106 Ramgopal Rao, V. ; Wijeratne, G. ; Chu, D. ; Brozek, T. ; Viswanathan, C. R. (1998) Plasma process induced abnormal 1/f noise behavior in deep sub-micron MOSFETs 3rd International Symposium on Plasma Process-Induced Damage (P2ID), Hawaii, USA . pp. 124-127. Conference or Workshop ItemJoshi, K. ; Hung, S. ; Mukhopadhyay, S. ; Chaudhary, V. ; Nanaware, N. ; Rajamohnan, B. ; Sato, T. ; Bevan, M. ; Wei, A. ; Noori, A. ; McDougal, B. ; Ni, C. ; Saheli, G. ; Lazik, C. ; Liu, P. ; Chu, D. ; Date, L. ; Datta, S. ; Brand, A. ; Swenberg, J. ; Mahapatra, S. (2013) HKMG process impact on N, P BTI: Role of thermal IL scaling, IL/HK integration and post HK nitridation In: 2013 IEEE International Conference on Reliability Physics Symposium (IRPS), 14-18 April, 2013, Anaheim, CA, USA. |