Boride layer growth kinetics during boriding of molybdenum by the Spark Plasma Sintering (SPS) technology

Yua, L. G. ; Khor, K. A. ; Sundararajan, G. (2006) Boride layer growth kinetics during boriding of molybdenum by the Spark Plasma Sintering (SPS) technology Surface and Coatings Technology, 201 (6). pp. 2849-2853. ISSN 0257-8972

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Official URL: http://www.sciencedirect.com/science/article/pii/S...

Related URL: http://dx.doi.org/10.1016/j.surfcoat.2006.05.042

Abstract

Molybdenum borides have potential industrial applications as abrasive, corrosion-resistant and electrode materials due to their high hardness values, chemical inertness, and electronic conductivity. In this work, boride layers are formed on the surface of Mo samples using a pack boriding method with the assistant of the spark plasma sintering (SPS) technique. The process was performed in the temperature range 1000-1400 °C and with a holding time of 30 min at the preset temperature. The microstructure, microhardness, and fracture toughness of the molybdenum boride layer are investigated by optical microscopy, X-ray diffraction and microhardness indentations. Results showed that the boride layer, mainly composed of MoB, have thickness in the range ~ 6-155 µm. The boriding kinetics is studied by linking the boride layer thickness with the boriding temperature. The activation energy and pre-exponential constant are estimated from the experimental results, and are found to be 218.8 J/mol and 1.41 cm2/s respectively. The MoB layers have a preferred orientation in the (002) direction, which is reflected by a distinct columnar growth observed in the optical micrographs of polished cross-sections of SPS samples.

Item Type:Article
Source:Copyright of this article belongs to Elsevier Science.
Keywords:Molybdenum Boride; Coatings; Spark Plasma Sintering Boriding; Diffusion; Layer Thickness; Growth Kinetics
ID Code:93522
Deposited On:20 Jun 2012 03:49
Last Modified:20 Jun 2012 03:49

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