Highly robust nanoscale planar double-gate MOSFET device and SRAM cell immune to gate-misalignment and process variations

Sachid, A. B. ; Kulkarni, G. S. ; Baghini, M. S. ; Sharma, D. K. ; Rao, V. R. (2009) Highly robust nanoscale planar double-gate MOSFET device and SRAM cell immune to gate-misalignment and process variations Proceedings of the IEEE International Workshop on Electron Devices & Semiconductor Technology, Mumbai, India . pp. 1-4.

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Official URL: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumb...

Related URL: http://dx.doi.org/10.1109/EDST.2009.5166136

Abstract

Gate misalignment and process variations are important challenges in sub-20 nm gate length planar double-gate (DG) MOSFET devices. For the first time, we demonstrate a misalignment- and process variations-aware device optimization strategy for a DG-MOSFET. Using underlaps and high-kappa offset-spacers, we show that the robustness of the device to gate misalignment and process variations can be improved. A standard 6T-SRAM cell designed using the optimized devices shows better read and hold static noise margins, and lower variations in SNM and leakage power compared to a conventional DG-MOSFET.

Item Type:Article
Source:Copyright of this article belongs to Proceedings of the IEEE International Workshop on Electron Devices & Semiconductor Technology, Mumbai, India.
ID Code:79739
Deposited On:28 Jan 2012 11:56
Last Modified:28 Jan 2012 11:56

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