Shanmugasundaram, Thangaraju ; Heilmaier, Martin ; Subramanya Sarma, V. ; Murty, B. S. (2011) Thermal stability of vacuum hot pressed bulk nanostructured Al-Cu alloys Materials Science Forum, 690 . pp. 234-237. ISSN 0255-5476
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Official URL: http://www.scientific.net/MSF.690.234
Related URL: http://dx.doi.org/10.4028/www.scientific.net/MSF.690.234
Abstract
Bulk nanostructured Al-4Cu alloy was synthesized by high energy ball milling followed by vacuum hot pressing. Its thermal stability was investigated up to 450°C using differential scanning calorimetry, X-ray diffraction, and transmission electron microscopy. The results showed that grain growth in this Al-4Cu alloy was very limited and grain sizes in the range of 100 nm were still present in the alloys after exposure to 450 °C corresponding to a temperature as high as 0.77 T/Tm. The TEM investigations reveal that such a high thermal stability against grain growth observed in this alloy is attributed to the presence of ultrafine dispersoids.
Item Type: | Article |
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Source: | Copyright of this article belongs to Trans Tech Publications Inc. |
Keywords: | Al-Cu Alloy; High-Energy Ball Milling (HEM); Nano-Crystalline Material; Thermal Stability; Vacuum Hot Pressing |
ID Code: | 73335 |
Deposited On: | 02 Dec 2011 10:39 |
Last Modified: | 02 Dec 2011 10:39 |
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