Dan, A. ; satpati, B. ; satyam, P. V. ; Chakravorty, D. (2003) Diodelike behavior in glass-metal nanocomposites Journal of Applied Physics, 93 (8). pp. 4794-4800. ISSN 0021-8979
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Official URL: http://link.aip.org/link/?JAPIAU/93/4794/1
Related URL: http://dx.doi.org/10.1063/1.1559429
Abstract
One-dimensional arrays of nanoparticles of silver and copper, respectively, have been grown within a silicate glass by an electrodeposition process. Silver-silica nanocomposites were prepared using a melt quenched glass whereas sol-gel derived glass was used for the synthesis of copper-silica nanocomposites. The metal particle diameters had values ranging from 1.5 to 20 nm. The composite structures exhibited a diodelike current-voltage characteristic in the temperature range 300 to 160 K for silver containing nanocomposites and at around 280 K for copper containing nanocomposites. The diode action is believed to be caused by the presence of metal-semiconductor nanojunctions in these glass-the typical number of such junctions being 60. The rather narrow range of temperature for diode action as observed in copper-silica nanocomposites is ascribed to the easy breakup of the metal nanoarrays because of the sol-gel derived medium of silica glass in which the metal phase was grown. The metal particles of diameter ~2 nm constituted the semiconducting phase in these nanojunctions.
Item Type: | Article |
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Source: | Copyright of this article belongs to American Institute of Physics. |
Keywords: | Silver; Copper; Nanoparticles; Nanocomposites; Electrodeposition; Particle Size; Nanocontacts; Semiconductor-metal Boundaries; Particle Reinforced Composites; Quenching (Thermal); Sol-gel Processing |
ID Code: | 65044 |
Deposited On: | 15 Oct 2011 12:16 |
Last Modified: | 15 Oct 2011 12:16 |
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