Banerjee, S. ; Chakravorty, D. (1998) Electrical resistivity of copper-silica nanocomposites synthesized by electrodeposition Journal of Applied Physics, 84 (2). pp. 1149-1151. ISSN 0021-8979
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Official URL: http://jap.aip.org/resource/1/japiau/v84/i2/p1149_...
Related URL: http://dx.doi.org/10.1063/1.368116
Abstract
Composites containing copper particles with nanometer dimensions in a silica gel medium have been synthesized by an electrodeposition technique. The precursor composition of the gel was in the system Cu(NO3)2-SiO2 and the copper particle diameters were in the range of 3.2-11.4 nm. The dc electrical resistivity of pellets obtained from the nanocomposite powders was measured in the temperature range of 110-300 K. A temperature dependence with a fractional exponent of 0.25 was observed. This behavior has been explained on the basis of a variable range hopping mechanism.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to American Institute of Physics. |
| Keywords: | Copper; Silicon Compounds; Electrical Resistivity; Nanostructured Materials; Composite Materials; Electrodeposition; Hopping Conduction |
| ID Code: | 65019 |
| Deposited On: | 15 Oct 2011 12:13 |
| Last Modified: | 15 Oct 2011 12:13 |
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