Shanmugasundaram, T. ; Heilmaier, M. ; Murty, B. S. ; Subramanya Sarma, V. (2010) On the hall-petch relationship in a nanostructured Al-Cu alloy Materials Science and Engineering: A, 527 (29-30). pp. 7821-7825. ISSN 0921-5093
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Official URL: http://www.sciencedirect.com/science/article/pii/S...
Related URL: http://dx.doi.org/10.1016/j.msea.2010.08.070
Abstract
Mechanical properties of bulk nanocrystalline Al-4Cu alloys with grain sizes from 47 to 105 nm, synthesized by mechanically alloying followed by vacuum hot pressing at different temperatures, were analysed through Hall-Petch relation. Hall-Petch analysis revealed a high frictional stress (170 MPa) and a high positive slope (0.13 Mpa √m) as compared to pure Al, which has a frictional stress (15-30 MPa) and a slope (0.06-0.09 Mpa √m). From a detailed evaluation of different strengthening mechanisms it is inferred that the Al2Cu precipitates and oxide particles are the likely reason for such high values of frictional stress and slope.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Elsevier Science. |
| Keywords: | Aluminum Alloys; Mechanical Alloying; Nanostructured Materials; Hot Pressing; Hall-Petch Relation |
| ID Code: | 64025 |
| Deposited On: | 04 Oct 2011 08:35 |
| Last Modified: | 04 Oct 2011 08:35 |
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