Dwivedi, Neeraj ; Sushil Kumar, (2012) Nanoindentation testing on copper/diamond-like carbon bi-layer films Current Applied Physics, 12 (1). pp. 247-253. ISSN 1567-1739
Full text not available from this repository.
Official URL: http://www.sciencedirect.com/science/article/pii/S...
Related URL: http://dx.doi.org/10.1016/j.cap.2011.06.013
Abstract
In the present work, the effect of indentation load on nano-mechanical properties of copper/diamond-like carbon (Cu/DLC) bi-layer films was explored. In addition, effect of Cu interlayer and influence of self bias on residual stress and various other nano-mechanical properties such as hardness (H) and elastic modulus (E) of Cu/DLC bi-layer films were also discussed. These Cu/DLC bi-layer films were deposited, using hybrid system involving radio frequency (RF)-plasma enhanced chemical vapor deposition and RF-sputtering units, under varied self biases from -125 to -225 V. The effect of penetration depth with varied load from 5 to 20 mN on H and E of these Cu/DLC bi-layer films was also analyzed.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Elsevier Science. |
| Keywords: | Plasma Deposition; Nanoindentation; Cu/DLC Bi-layer |
| ID Code: | 52069 |
| Deposited On: | 02 Aug 2011 08:01 |
| Last Modified: | 18 Jun 2012 11:16 |
Repository Staff Only: item control page
