Sarkar, Jayati ; Annepu, Hemalatha ; Sharma, Ashutosh (2011) Contact instability of a soft elastic film bonded to a patterned substrate The Journal of Adhesion, 87 (3). pp. 214-234. ISSN 0021-8464
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Official URL: http://www.informaworld.com/smpp/content~db=all~co...
Related URL: http://dx.doi.org/10.1080/00218464.2011.557332
Abstract
A linear stability analysis is presented for the contact instability of a soft thin elastic film which is rigidly bonded to a physically patterned substrate, and is in adhesive contact with a smooth rigid contactor. Increasing roughness by enhancing the substrate-amplitude produces increasingly smaller instability length-scales. The smallest wavelengths obtainable are 0.3*h, an order of magnitude smaller than that observed with films on flat substrates (3*h). Instability length-scales are found to be largely independent of substrate length-scales. For van der Waals interaction, increase in substrate roughness increases the energy penalty and, consequently, requires smaller gap distances (< 1nm for stiff films) to engender instabilities. When an externally controllable long-range electric field is employed instead, instabilities can be initiated at very low critical voltages (˜32 V) even in relatively stiff films, making it a more suitable route to produce miniaturized instability patterns.
Item Type: | Article |
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Source: | Copyright of this article belongs to Taylor and Francis Group. |
Keywords: | Contact Instability; Elastic Film; Linear Stability Analysis; Pattern Formation; Patterned Substrate; Soft Adhesion |
ID Code: | 47025 |
Deposited On: | 06 Jul 2011 11:13 |
Last Modified: | 06 Jul 2011 11:13 |
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