Contact instability of a soft elastic film bonded to a patterned substrate

Sarkar, Jayati ; Annepu, Hemalatha ; Sharma, Ashutosh (2011) Contact instability of a soft elastic film bonded to a patterned substrate The Journal of Adhesion, 87 (3). pp. 214-234. ISSN 0021-8464

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Official URL: http://www.informaworld.com/smpp/content~db=all~co...

Related URL: http://dx.doi.org/10.1080/00218464.2011.557332

Abstract

A linear stability analysis is presented for the contact instability of a soft thin elastic film which is rigidly bonded to a physically patterned substrate, and is in adhesive contact with a smooth rigid contactor. Increasing roughness by enhancing the substrate-amplitude produces increasingly smaller instability length-scales. The smallest wavelengths obtainable are 0.3*h, an order of magnitude smaller than that observed with films on flat substrates (3*h). Instability length-scales are found to be largely independent of substrate length-scales. For van der Waals interaction, increase in substrate roughness increases the energy penalty and, consequently, requires smaller gap distances (< 1nm for stiff films) to engender instabilities. When an externally controllable long-range electric field is employed instead, instabilities can be initiated at very low critical voltages (˜32 V) even in relatively stiff films, making it a more suitable route to produce miniaturized instability patterns.

Item Type:Article
Source:Copyright of this article belongs to Taylor and Francis Group.
Keywords:Contact Instability; Elastic Film; Linear Stability Analysis; Pattern Formation; Patterned Substrate; Soft Adhesion
ID Code:47025
Deposited On:06 Jul 2011 11:13
Last Modified:06 Jul 2011 11:13

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