Embedded micro-structures by electric field induced pattern formation in interacting thin layers

Srivastava, Samanvaya ; Bandyopadhyay, Dipankar ; Sharma, Ashutosh (2010) Embedded micro-structures by electric field induced pattern formation in interacting thin layers Langmuir, 26 (13). pp. 10943-10952. ISSN 0743-7463

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Official URL: http://pubs.acs.org/doi/abs/10.1021/la100968p

Related URL: http://dx.doi.org/10.1021/la100968p

Abstract

Electric-field-induced interfacial instabilities and pattern formation in a pair of interacting thin films are analyzed on the basis of linear stability analysis and long-wave nonlinear simulations. The films are coated onto two parallel plate electrodes and separated by an air gap between them. A linear stability analysis (LSA) is carried out for viscoelastic films to show that the ratios of material properties to films thickness control the length scale and timescale significantly and the presence of the second layer increases the overall capacitance and thus can lead to a smaller length scale as compared to the instability in a single film. Long-wave nonlinear analysis for interacting viscous layers indicates that the instabilities are always initiated by the antiphase squeezing rather than the in-phase bending mode of deformation at the interfaces. Nonlinear simulations on patterned electrodes show that this novel geometry for electric field patterning can be employed to generate intricate, embedded 3-D periodic patterns and to miniaturize patterns. Simulations are presented for e-molding of a number of periodic self-organized patterns such as pincushion structures, straight/corrugated embedded microchannels, and microbubbles. A few interesting examples are also shown where (1) the pathway of evolution changes without altering the equilibrium morphology when kinetic parameters such as viscous forces are changed and (2) the self-organized equilibrium morphology does not reproduce the underlying patterns on the electrodes.

Item Type:Article
Source:Copyright of this article belongs to American Chemical Society.
ID Code:47012
Deposited On:06 Jul 2011 11:11
Last Modified:06 Jul 2011 11:11

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