Sosamma, S. ; Kasinathan, M. ; Pandian, C. ; Babu Rao, C. ; Jayakumar, T. ; Murali, N. ; Baldev Raj, (2010) Bond monitoring in temperature-dependent applications by FBG spectra decomposition Insight, 52 (11). pp. 617-619. ISSN 1354-2575
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Official URL: http://www.atypon-link.com/BINT/doi/abs/10.1784/in...
Related URL: http://dx.doi.org/10.1784/insi.2010.52.11.617
Abstract
A high-temperature bond has to be evaluated for its integrity at elevated temperatures. There are no validated techniques to test its performance. In this paper we propose a Fibre Bragg Grating (FBG)-based methodology to detect temperature-induced adhesive failure up to 300°C. The differential coefficient of thermal expansion between the substrate and the bond can lead to bond failure at high temperature. FBG impregnated in the bond will experience differential strain due to cracking of the bond. This leads to spectral decomposition of the reflected FBG spectra. This is a good indication for real-time monitoring of the integrity of a bond for high-temperature applications.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to British Institute of Non-Destructive Testing. |
| Keywords: | Integrity of Bond; Fibre Bragg Grating; Spectral Decomposition |
| ID Code: | 40659 |
| Deposited On: | 24 May 2011 11:30 |
| Last Modified: | 24 May 2011 11:30 |
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