Subramanian, C. V. ; Thavasimuthu, M. ; Palanichamy, P. ; Bhattacharya, D. K. ; Baldev Raj, (1991) Evaluation of bond integrity in sandwiched structures by dry couplant ultrasonic technique NDT & E International, 24 (1). pp. 29-31. ISSN 0963-8695
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Official URL: http://linkinghub.elsevier.com/retrieve/pii/096386...
Related URL: http://dx.doi.org/10.1016/0963-8695(91)90679-W
Abstract
The ultrasonic dry-couplant technique has been used to evaluate adhesive bonds in honeycomb and aluminium-fibre reinforced plastic-aluminium sandwich materials. The technique does not require conventional liquid couplant. Both pitch-catch and through transmission methods were adopted. Disbonds have been successfully detected and evaluated using the technique.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Elsevier Science. |
| Keywords: | Ultrasonic Testing; Dry Couplant; Pitch-catch; through Transmission; Honeycomb; Sandwiched Materials; Bond Evaluation |
| ID Code: | 40291 |
| Deposited On: | 23 May 2011 11:34 |
| Last Modified: | 23 May 2011 11:34 |
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