Effect of microstructure on the high temperature strength of nitride bonded silicon carbide composite

Rakshit, J. ; Das, P. K. (2002) Effect of microstructure on the high temperature strength of nitride bonded silicon carbide composite Bulletin of Materials Science, 25 (5). pp. 387-390. ISSN 0250-4707

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Official URL: http://ns1.ias.ac.in/matersci/bmsoct2002/387.pdf

Related URL: http://dx.doi.org/10.1007/BF02708015

Abstract

Four compositions of nitride bonded SiC were fabricated with varying particle size of SiC of ~ 9.67, ~ 13.79, ~ 60 μ and their mixture with Si of ~ 4.83 μ particle size. The green density and hence the open porosity of the shapes were varied between 1.83 to 2.09 g/cc and 33.3 to 26.8 vol.%, respectively. The effect of these parameters on room temperature and high temperature strength of the composite up to 1300°C in ambient condition were studied. The high temperature flexural strength of the composite of all compositions increased at 1200 and 1300°C because of oxidation of Si3N4 phase and blunting crack front. Formation of Si3N4 whisker was also observed. The strength of the mixture composition was maximum.

Item Type:Article
Source:Copyright of this article belongs to Indian Academy of Sciences.
Keywords:Nitride Bonded Silicon Carbide Composite; Nitridation; Microstructure
ID Code:30481
Deposited On:23 Dec 2010 13:29
Last Modified:17 May 2016 13:06

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