Thakoor, A. P. ; Suri, Ritu ; Suri, S. K. ; Chopra, K. L. (1975) Structural defect thermoelectric power in thin copper films Applied Physics Letters, 26 (4). pp. 160-162. ISSN 0003-6951
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Official URL: http://apl.aip.org/resource/1/applab/v26/i4/p160_s...
Related URL: http://dx.doi.org/10.1063/1.88099
Abstract
Thermoelectric power and electrical resistivity of thin (< 1000 Å) copper films annealed at different temperatures have been studied. The data have been utilized to obtain the contribution to thermoelectric power by the structural defects in the films. This contribution is comparable in magnitude to the bulk value. It increases with film thickness giving rise to a strong thickness dependence of thermoelectric power at thicknesses considerably larger than the mean free path of the conduction electrons.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to American Institute of Physics. |
| ID Code: | 23218 |
| Deposited On: | 25 Nov 2010 13:17 |
| Last Modified: | 28 May 2011 10:00 |
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