Chopra, K. L. ; Bahl, S. K. ; Randlett, M. R. (1968) Thermopower in thin-film copper-Constantan couples Journal of Applied Physics, 39 (3). pp. 1525-1528. ISSN 0021-8979
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Official URL: http://jap.aip.org/resource/1/japiau/v39/i3/p1525_...
Related URL: http://dx.doi.org/10.1063/1.1656389
Abstract
The thickness dependence of the thermal emf of thin-film copper-constantan thermocouples at room temperature and above shows nearly bulklike behavior when the thickness of both elements comprising the thermocouple is greater than ∼1200 Å. The thermal response time of the thermocouples as measured with a pulsed laser beam heating source is less than 10-6 sec. The thickness-dependent contribution to the thermopower of copper films is deduced from the thermal emf data on thermocouples formed with a thick constantan film and compared with the size-effect theory based on the free-electron model. The marked thickness dependence observed yields anomalously high dependence (an order-of-magnitude higher) of the mean free path on the energy of electrons. This result is tentatively ascribed to the thermopower behavior of a transition layer formed by diffusion of the two components of the thermocouples.
Item Type: | Article |
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Source: | Copyright of this article belongs to American Institute of Physics. |
ID Code: | 23196 |
Deposited On: | 25 Nov 2010 13:19 |
Last Modified: | 28 May 2011 10:23 |
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