Synthesis of copper alloys with extended solid solubility and nano Al₂O₃ dispersion by mechanical alloying and equal channel angular pressing

Abstract

Cu-4.5 wt % Cr and Cu-4.5 wt % Cr-3 wt % Ag alloys, with and without nanocrystalline Al₂O₃ dispersions (particle size <10 nm), were synthesized by mechanical alloying/milling and consolidated by equal-channel angular pressing (ECAP) at ambient temperature. Microstructural characterization and phase analysis by X-ray diffraction, as well as scanning and transmission electron microscopy, provided evidence for the formation of a Cu-rich extended solid solution with nanometric (<30 nm) crystallite size after 25 h of milling, with uniformly dispersed alumina nanoparticles embedded in it. Consolidation of Cu-4.5 wt % Cr-3 wt % Ag alloy with 10 wt % nanocrystalline Al₂O₃ by eight ECAP passes was shown to result in a composite with an exceptionally large hardness of 390 VHN and enhanced wear resistance. The electrical conductivity of the pellets of the latter alloy without Al₂O₃ is about 30% IACS (international annealing copper standard), whereas pellets with 5 or 10 wt % Al₂O₃ dispersion exhibit a conductivity of about 20-25% IACS. Thus, the present room temperature synthesis and consolidation route appear to offer a promising avenue for developing high-strength, wear/erosion-resistant Cu-based electrical contacts with nano-ceramic dispersion.