Electron back scattered diffraction characterization of thermomechanical fatigue crack propagation of a near α titanium alloy Timetal 834

Prasad, Kartik ; Karamched, Phani S. ; Bhattacharjee, A. ; Kumar, Vikas ; Bhanu Sankara Rao, K. ; Sundararaman, M. (2015) Electron back scattered diffraction characterization of thermomechanical fatigue crack propagation of a near α titanium alloy Timetal 834 Materials & Design, 65 . pp. 297-311. ISSN 0261-3069

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Official URL: http://doi.org/10.1016/j.matdes.2014.09.006

Related URL: http://dx.doi.org/10.1016/j.matdes.2014.09.006

Abstract

Fatigue crack growth (FCG) mechanisms have been studied in light of the interaction of a propagating crack with local crystallographic orientations of primary alpha (αP) and secondary alpha (αS) colonies in a near α Timetal 834 Ti-alloy under thermomechanical fatigue (TMF) loading using electron backscattered diffraction (EBSD). FCG testing at in-phase (IP) and out-of-phase (OP) TMF loading have been carried out at two temperature intervals 300 °C ↔ 450 °C and 450 °C ↔ 600 °C. EBSD analysis and microhardness measurements have confirmed that larger cyclic plastic zone size at the crack tip leads to lower crack propagation under IP-TMFCG loading as compared to OP-TMFCG loading. EBSD analysis has also confirmed that crack dissipates more energy to propagate when it passes from a soft grain oriented with its c-axis normal to the loading direction and encounters a hard grain with its c-axis parallel with the loading direction.

Item Type:Article
Source:Copyright of this article belongs to Elsevier Science.
Keywords:Schmid factor; fracture; crystal plasticity; slip; microstructure
ID Code:133477
Deposited On:29 Dec 2022 04:07
Last Modified:29 Dec 2022 04:07

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