Interdiffusion studies in bulk Au–Ti system

Kumar, A. K. ; Paul, A. (2010) Interdiffusion studies in bulk Au–Ti system Journal of Materials Science: Materials in Electronics, 21 (11). pp. 1202-1206. ISSN 0957-4522

Full text not available from this repository.

Official URL: http://doi.org/10.1007/s10854-009-0047-5

Related URL: http://dx.doi.org/10.1007/s10854-009-0047-5

Abstract

The performance of the contacts, where Au/Ti layers are used in the metallization scheme, largely depends on the product phases grown by interdiffusion at the interface. It is found that four intermetallic compounds grow with narrow homogeneity range and wavy interfaces in the interdiffusion zone. The presence of wavy interfaces is the indication of high anisotropy in diffusion of the product phases. This also reflects in the deviation of parabolic growth from the average. Further, we have determined the relevant diffusion parameters, such as interdiffusion coefficient in the penetrated region of the end members and integrated diffusion coefficients of the intermetallic compounds.

Item Type:Article
Source:Copyright of this article belongs to Springer-Verlag.
ID Code:121297
Deposited On:14 Jul 2021 05:51
Last Modified:14 Jul 2021 05:51

Repository Staff Only: item control page