Paul, A. ; Laurila, T. (2012) Comments on “Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints” Intermetallics, 28 . pp. 164-165. ISSN 0966-9795
Full text not available from this repository.
Official URL: http://doi.org/10.1016/j.intermet.2012.04.005
Related URL: http://dx.doi.org/10.1016/j.intermet.2012.04.005
Abstract
Othman et al. (Intermetallics 2012;22:1–6) recently published a manuscript on “Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints”. We found problems in calculation of diffusion parameters. Even the comment on the formation of Cu5Zn8 instead of Cu6Sn5 is not correct. In this comment, we have explained the correct procedure to calculate the diffusion coefficients. Further, we have also explained the reason for the formation of Cu5Zn8 instead of Cu6Sn5 in the Cu/ Sn–9Zn system.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Elsevier Science. |
| ID Code: | 121254 |
| Deposited On: | 13 Jul 2021 07:27 |
| Last Modified: | 13 Jul 2021 07:27 |
Repository Staff Only: item control page
