Mishra, Bibhudutta ; Kiruthika, Perumalsamy ; Paul, Aloke (2014) Interdiffusion in the Cu–Pt system Journal of Materials Science: Materials in Electronics, 25 (4). pp. 1778-1782. ISSN 0957-4522
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Official URL: http://doi.org/10.1007/s10854-014-1798-1
Related URL: http://dx.doi.org/10.1007/s10854-014-1798-1
Abstract
Experiments are conducted to study interdiffusion in a complete solid solution as well as in ordered phases in the Cu–Pt system. The variation of the interdiffusion coefficient and the activation energy with composition of the solid solution is explained with the help of melting points, vacancy formation energies and thermodynamic factors indicating the driving force for diffusion. Additionally, interdiffusion coefficients are also estimated in the CuPt and Cu3Pt phases at two different temperatures.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Springer-Verlag. |
| ID Code: | 121222 |
| Deposited On: | 13 Jul 2021 06:04 |
| Last Modified: | 13 Jul 2021 06:04 |
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