Stone, D. ; Wilson, H. ; Subrahmanyan, R. ; Li, Che-Yu (1986) Deformation properties of a lead-tin (95–5) solder MRS Proceedings, 72 . Article ID 175. ISSN 1946-4274
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Official URL: https://www.cambridge.org/core/journals/mrs-online...
Related URL: http://dx.doi.org/10.1557/PROC-72-175
Abstract
Consecutive load relaxation tests are performed on a 95 Pb-5 Sn specimen near room temperature, then at 69 ° C and 1°C. The initial relaxation runs at room temperature show evidence of static recovery, which diminishes after a number of load relaxations have been performed. Evidence of grain boundary sliding is also found. The specimen hardens slowly at 69°C, as manifested by successive load relaxation data falling at lower strain rates. At 1°C, the material slowly softens. These temperature effects are believed to result from a dislocation-solute interaction involving tin atoms in the lead matrix.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Cambridge University Press. |
| ID Code: | 114428 |
| Deposited On: | 22 May 2018 08:17 |
| Last Modified: | 22 May 2018 08:17 |
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