Understanding the adhesion and optical properties of eutectic metal alloys for solution-processed electronics

Abstract

The role of indium in controlling the adhesion and the optical properties of fusible, low- melting alloys is highlighted in this work. The optical activity of indium-alloy/polymer interface is probed using surface-enhanced Raman spectroscopy, which shows a large increase in polymer Raman modes intensity. Signatures of plasmon and chemically enhanced Raman are visible for more than one polymer. Improvement in adhesion is also reflected in their ability to coat conformally onto the polymer surface resulting in a suitable interface for electrical transport. The electrical characteristics of alloy electrodes, which are printed in ambient conditions, are superior when compared to the thermally evaporated aluminum cathodes. Raman and responsivity measurements indicate that indium (In) forms metal/organic hybrid charge-transfer states at the alloy/polymer interface and assumes a decisive role in controlling the mechanical, optical, and electrical properties of these electrodes. Our studies suggest that the indium present in small quantities (∼5 wt. %) can significantly improve the overall performance of the low-temperature printable eutectic alloy electrodes.