Mohapatra, N. R. ; Mahapatra, S. ; Rao, V. R. ; Shukuri, S. ; Bude, J. (2003) Effect of programming biases on the reliability of CHE and CHISEL flash EEPROMs In: 41st Annual 2003 IEEE International Reliability Physics Symposium Proceedings, 30 March-4 April, 2003, Dallas, TX, USA.
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Official URL: http://ieeexplore.ieee.org/document/1197802/
Related URL: http://dx.doi.org/10.1109/RELPHY.2003.1197802
Abstract
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE and CHISEL operation. CHE degradation increases at higher control gate bias (VCG) and is insensitive to changes in drain bias (VD) CHISEL degradation is insensitive to changes in both VCG and VD. Furthermore, CHISEL always shows lower degradation when compared to CHE under identical bias and similar programming time. The possible physical mechanisms responsible for the above behavior are clarified by using full band Monte-Carlo simulations.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Source: | Copyright of this article belongs to Institute of Electrical and Electronics Engineers. |
| ID Code: | 112671 |
| Deposited On: | 12 Apr 2018 07:22 |
| Last Modified: | 12 Apr 2018 07:22 |
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