Kumar, P. B. ; Nair, D. R. ; Mahapatra, S. (2006) Using Soft Secondary Electron Programming to reduce drain disturb in floating-gate NOR flash EEPROMs IEEE Transactions on Device and Materials Reliability, 6 (1). pp. 81-86. ISSN 1530-4388
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Official URL: http://ieeexplore.ieee.org/abstract/document/16186...
Related URL: http://dx.doi.org/10.1109/TDMR.2006.871149
Abstract
A novel concept of Soft Secondary Electron Programming (SSEP) is introduced and shown to be a promising programming scheme for scaled NOR flash electrically erasable programmable read-only memories. Although the mechanism is similar to that of the Channel-initiated Secondary Electron (CHISEL) programming, SSEP uses an "optimum" substrate bias that results in a lower drain disturb compared with both Channel Hot Electron (CHE) and conventional CHISEL programming schemes. The concept behind minimizing drain disturb is discussed. SSEP is shown to give faster programming and lower disturb than CHE at all operating conditions, as well as better program/disturb margin compared with conventional CHISEL programming at similar program speed or disturb time. The effect of repeated program/erase cycling using SSEP is compared against CHE and CHISEL cycling.
Item Type: | Article |
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Source: | Copyright of this article belongs to Institute of Electrical and Electronics Engineers. |
Keywords: | Secondary Electrons; Band-to-band Tunneling; Channel Hot Electron (CHE); Channel-initiated Secondary Electron (CHISEL); Cycling Endurance; Drain Disturb; Flash Electrically Erasable Programmable Read-only Memory (EEPROM) |
ID Code: | 112653 |
Deposited On: | 02 Apr 2018 09:35 |
Last Modified: | 02 Apr 2018 09:35 |
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