Radha, B. ; Kulkarni, G. U. (2009) Dewetting assisted patterning of polystyrene by soft lithography to create nanotrenches for nanomaterial deposition ACS Applied Materials & Interfaces, 1 (2). pp. 257-260. ISSN 1944-8244
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Official URL: http://pubs.acs.org/doi/abs/10.1021/am800172f
Related URL: http://dx.doi.org/10.1021/am800172f
Abstract
Micromolding in capillaries of polystyrene has been carried out using a poly(dimethylsiloxane) stamp, derived from a compact disk (CD) as master, while heating above the glass transition temperature of polystyrene. The resulting pattern contained a replica of the parallel channels but with an important difference that trenches of width ∼30 nm were found in between. The nanotrenches in polystyrene could be filled with metals by physical vapor deposition and electroless plating. This method finds potential applications in nanoelectronics and nanofluidics.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to American Chemical Society. |
| Keywords: | Dewetting; Metal Nanopatterns.; Micromolding in Capillaries; Nanotrenches; Polystyrene; Soft Lithography |
| ID Code: | 103042 |
| Deposited On: | 28 Feb 2017 16:44 |
| Last Modified: | 28 Feb 2017 16:44 |
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