Analysis of constrained piezoelectric layer: a two-dimensional coupled electromechanical model

Abstract

A new analytical model based on 2D electro-mechanical continuum coupled-field model is developed to analyze the performance of deformable thin-film capacitive sensors, surface-mounted or embedded in composite material system. Viscoelastic property of the bonding layer and the effect of constrained boundary on the capacitive performance are considered. Analytical solutions for specific cases of boundary constraints on the film, such as in-plane tensile stress, transverse normal stress and horizontal shear stress are modeled. Effect of process-induced residual stress and small crack on the capacitive performance is also studied. The results show significant complexity, which is otherwise intractable using existing simplified approaches.