Two dimensional stress analyses of laminates under thermal load

Abstract

Thermal analysis of laminates under plane stress and plane strain conditions of elasticity have been performed with the newly developed mixed semi-analytical model. The displacements and transverse stresses that occur naturally at an interface of laminae are considered as fundamental dependent variables and thus continuity of transverse stresses and displacements are implicitly maintained at the laminae interfaces. The mathematical model consists of defining a two-point boundary value problem (BVP) governed by a set of coupled first-order ordinary differential equations (ODEs). Fourth­order Runga-Kutta-Gill algorithm is used for numerical integration. Two different temperature variations through the thickness (available in the literature) are used here for numerical investigations. The accuracy and the effectiveness of the proposed model are assessed by comparing numerical results from the present investigation with the available elasticity solutions under plane stress conditions. Further, numerical investigations are extended for plane strain conditions and important results are presented, not available so far, could be useful as benchmark solutions for future investigations.