Effect of pulse plating and additive on phase separation in Cu–Co nano-granular alloys

Ghosh, S. K. ; Bera, T. ; Saxena, C. ; Bhattacharya, S. ; Dey, G. K. (2009) Effect of pulse plating and additive on phase separation in Cu–Co nano-granular alloys Journal of Alloys and Compounds, 475 (1-2). pp. 676-682. ISSN 0925-8388

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Official URL: http://www.sciencedirect.com/science/article/pii/S...

Related URL: http://dx.doi.org/10.1016/j.jallcom.2008.07.137


Pulse electrolysis was employed to deposit heterogeneous Cu–Co alloys from complexed sulphate–citrate electrolyte. The crystal structure, surface morphology and microstructure of the deposited alloys were analysed to understand the effect of process parameters on the deposit. X-ray and selected area electron diffraction (SAED) studies showed that as-deposited films were composed of two phases, a solid solution of face centred cubic Cu–Co phase and a hexagonal close packed Co phase. Pulse electrolysis and addition of saccharine within the electrolyte were found to enhance in forming two-phase structure. Surface morphology of the pulse current (PC) plated alloys was found to be smoother than their direct current (DC) counterparts. Presence of saccharine within the electrolyte led to further improvement in brightness of the deposits top layer. Microstructural investigations revealed that the deposited alloys were nanocrystalline in nature. Further refinement in grain size and increased homogeneity in microstructure were observed in the presence of saccharine.

Item Type:Article
Source:Copyright of this article belongs to Elsevier Science.
Keywords:Cu–Co Alloys; Granular Alloys; Microstructure; Transmission Electron Microscopy (TEM); X-ray Diffraction
ID Code:84937
Deposited On:28 Feb 2012 08:54
Last Modified:28 Feb 2012 08:54

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