Chokshi, Atul H. (2003) The influence of grain size on deformation on copper Materials Science Forum, 426-432 . pp. 4393-4398. ISSN 0255-5476
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Official URL: http://www.scientific.net/MSF.426-432.4393
Related URL: http://dx.doi.org/10.4028/www.scientific.net/MSF.426-432.4393
Abstract
It is well know that grain boundaries enhance strength at low temperatures by acting as obstacles to dislocation motion, and they retard strength at higher temperatures by processes involving grain boundary sliding. The available data on the influence of grain boundaries on deformation in copper is summarized. Equi-channel angular extrusion offers a convenient means for imposing severe plastic deformation to refine the grain size in bulk materials. Experimental data on fine grained copper produced by equi-channel angular extrusion will be described, and the implications of the data for diffusion creep and superplasticity will be discussed.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Trans Tech Publications Inc. |
| Keywords: | Nanocrystalline; Hall-Petch; Grain Boundary Sliding; Diffusion Creep; Superplasticity |
| ID Code: | 84173 |
| Deposited On: | 24 Feb 2012 11:16 |
| Last Modified: | 24 Feb 2012 11:16 |
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