Effects of mould filling on evolution of the solid-liquid interface during solidification

Pathak, Nitin ; Kumar, Arvind ; Yadav, Anil ; Dutta, Pradip (2009) Effects of mould filling on evolution of the solid-liquid interface during solidification Applied Thermal Engineering, 29 (17-18). pp. 3669-3678. ISSN 1359-4311

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Official URL: http://www.sciencedirect.com/science/article/pii/S...

Related URL: http://dx.doi.org/10.1016/j.applthermaleng.2009.06.026

Abstract

This work presents a numerical analysis of simultaneous mould filling and phase change for solidification in a two-dimensional rectangular cavity. The role of residual flow strength and temperature gradients within the solidifying domain, caused by the filling process, on the evolution of solidification interface are investigated. An implicit volume of fluid (VOF)-based algorithm has been employed for simulating the free surface flows during the filling process, while the model for solidification is based on a fixed-grid enthalpy-based control volume approach. Solidification modeling is coupled with VOF through User Defined Functions developed in the commercial computational fluid dynamics (CFD) code FLUENT 6.3.26. Comparison between results of the conventional analysis without filling effect and those of the present analysis shows that the residual flow resulting from the filling process significantly influences the progress of the solidification interface. A parametric study is also performed with variables such as cooling rate, filling velocity and filling configuration, in order to investigate the coupled effects of the buoyancy-driven flow and the residual flow on the solidification behavior.

Item Type:Article
Source:Copyright of this article belongs to Elsevier Science.
Keywords:Filling; Solidification; Residual Flow; Volume of Fluid
ID Code:80897
Deposited On:02 Feb 2012 09:33
Last Modified:02 Feb 2012 09:33

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