Kale, N. S. ; Nag, S. ; Pinto, R. ; Rao, V. R. (2008) Photoplastic NEMS with an encapsulated polysilicon piezoresistor Proceedings of the 8th IEEE Conference on Nanotechnology (IEEE NANO 2008), Arlington, Texas USA . pp. 460-463.
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Official URL: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumb...
Related URL: http://dx.doi.org/10.1109/NANO.2008.140
Abstract
We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Proceedings of the 8th IEEE Conference on Nanotechnology (IEEE NANO 2008), Arlington, Texas USA. |
| ID Code: | 79746 |
| Deposited On: | 28 Jan 2012 11:54 |
| Last Modified: | 28 Jan 2012 11:54 |
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