Ganesan, P. G. ; Cui, G. ; Vijayamohanan, K. ; Lane, M. ; Ramanath, G. (2005) Effects of amine- and pyridine-terminated molecular nanolayers on adhesion at Cu-SiO2 interfaces Journal of Vacuum Science and Technology B, 23 (1). pp. 327-331. ISSN 1071-1023
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Official URL: http://avspublications.org/jvstb/resource/1/jvtbd9...
Related URL: http://dx.doi.org/10.1116/1.1856467
Abstract
Recent work has shown that molecular nanolayers (MNLs) are attractive candidates for isolating and enhancing adhesion of Cu/SiO2 interfaces for sub 100 nm integrated circuits. Here, we report the effects of solution concentration and SiO2 surface treatment on the adhesion of Cu/SiO2 interfaces treated with organosilane MNLs with two different nitrogen-containing termini. MNLs from 5 mM concentration solution form monolayers and enhance adhesion, while 50 mM solutions form multilayers via unregulated self-polymerization, leading to inferior adhesion. Electron spectroscopy of fracture surfaces reveals that the Cu/MNL interface is the weakest link.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to AVS (American Vacuum Society). |
| Keywords: | Copper; Silicon Compounds; Interface Structure; Adhesion; Polymers; Surface Treatment; Polymerisation |
| ID Code: | 68920 |
| Deposited On: | 08 Nov 2011 04:39 |
| Last Modified: | 08 Nov 2011 04:39 |
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