Peralta, P. ; Ramamurty, U. ; Suresh, S. ; Campbell, G. H. ; King, W. E. ; Mitchell, T. E. (2001) Effects of anisotropy and slip geometry on fatigue fracture of Cu/sapphire bicrystals Materials Science and Engineering: A, 314 (1-2). pp. 55-66. ISSN 0921-5093
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Official URL: http://www.sciencedirect.com/science/article/pii/S...
Related URL: http://dx.doi.org/10.1016/S0921-5093(00)01939-0
Abstract
Interfacial fatigue cracks were propagated in Cu/sapphire bicrystals with (110)Cu||[101̅0]Al2O3/[001]Cu||[0001]Al2O3 to study the effect of anisotropy and slip geometry in the fracture process. Compact tension specimens with two different crystallographic crack growth directions were loaded to Δ KIa⋍2 Mpa m1/2 with R· 0. Interfacial cracks grew preferentially along <110>Cu and less favorably along <001>Cu. Large areas of the copper fracture surface were relatively featureless for crack growth along <110>Cu, whereas well defined striations could be observed for the second direction. A refined elastic analysis of the anisotropic near-tip fields for the interfacial crack revealed that the preferential crack growth direction had the highest energy release rate and mode I crack tip opening displacement. The second direction corresponded to a minimum mode II mix. Similar correlations were found in other Cu/sapphire bicrystal experiments described in the literature. Dislocation nucleation from the interfacial crack tip is also analyzed.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Elsevier Science. |
| Keywords: | Anisotropy; Cu; Sapphire Bicrystal; Interfacial Crack; Compact Tension |
| ID Code: | 62482 |
| Deposited On: | 22 Sep 2011 03:06 |
| Last Modified: | 22 Sep 2011 03:06 |
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