Controlling the size, morphology, and aspect ratio of nanostructures using reverse micelles: a case study of copper oxalate monohydrate

Ranjan, Rajeev ; Vaidya, Sonalika ; Thaplyal, Pallavi ; Qamar, Mohd ; Ahmed, Jahangeer ; Ganguli, Ashok K. (2009) Controlling the size, morphology, and aspect ratio of nanostructures using reverse micelles: a case study of copper oxalate monohydrate Langmuir, 25 (11). pp. 6469-6475. ISSN 0743-7463

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Official URL: http://pubs.acs.org/doi/abs/10.1021/la900063q

Related URL: http://dx.doi.org/10.1021/la900063q

Abstract

This study focuses on understanding the growth and control of nanostructures using reverse micelles. It has been earlier realized that parameters like surfactant, cosurfactant, and aqueous content influence the size and shape of the nanostructures obtained using reverse micelles. However, a concerted effort to understand the role of these factors on the growth of a specific nanomaterial is missing. In this study we have focused on one nanomaterial (copper oxalate monohydrate) and determined how the above-mentioned factors control the size, shape, aspect ratio, and growth of these nanostructures. Our results show that cationic surfactants (CTAB, TTAB, and CPB) favor the formation of nanorods of copper oxalate. The aspect ratio of these rods could be controlled to obtain nanocubes (~80-100 nm) and nanoparticles (~8-10 nm) in the CTAB system using longer chain cosurfactants like 1-octanol and 1-decanol, respectively. Nanocubes of ~50-60 and ~60-80 nm were obtained using nonionic surfactants Triton X-100 and Tergitol, respectively. The size of the nanostructures could also be controlled by varying the molar ratio of water to surfactant (W0) by using a nonionic (Triton X-100)-based reverse micellar system. The study espouses the versatility of the microemulsion method to realize a variety of nanostructures of copper oxalate monohydrate. Our results will be of use in extending these ideas to other nanomaterials.

Item Type:Article
Source:Copyright of this article belongs to American Chemical Society.
ID Code:61994
Deposited On:16 Sep 2011 03:57
Last Modified:16 Sep 2011 03:57

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