A semidestructive method for three dimensional photoelasticity

Srinath, L. S. ; Keshavan, S. Y. (1980) A semidestructive method for three dimensional photoelasticity Strain, 16 (4). pp. 143-148. ISSN 0039-2103

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Official URL: http://onlinelibrary.wiley.com/doi/10.1111/j.1475-...

Related URL: http://dx.doi.org/10.1111/j.1475-1305.1980.tb00344.x


Using the principle of optical equivalence and the experimentally determined characteristic parameters, it is possible to determine the variations of the secondary principal stresses and their directions across the thickness of a slice taken from a three dimensional photoelastic model. With these data, the shear difference method can be applied without cutting the slice into a subslice. This technique is applied to determine the stresses along a general line in a cone subjected to a compressive load at the apex. In practice, a fairly thick slice can be taken for analysis.

Item Type:Article
Source:Copyright of this article belongs to John Wiley and Sons.
Keywords:Optical Equivalence; Three Dimensional Photoelasticity
ID Code:53147
Deposited On:05 Aug 2011 07:30
Last Modified:05 Aug 2011 07:30

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