The mechanism of the recrystallization process in epitaxial GaN under dynamic stress field: atomistic origin of planar defect formation

Das, C. R. ; Dhara, S. ; Hsu, H. C. ; Chen, L. C. ; Jeng, Y. R. ; Bhaduri, A. K. ; Baldev Raj, ; Chen, K. H. ; Albert, S. K. (2009) The mechanism of the recrystallization process in epitaxial GaN under dynamic stress field: atomistic origin of planar defect formation Journal of Raman Spectroscopy, 40 (12). pp. 1881-1884. ISSN 0377-0486

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Official URL: http://onlinelibrary.wiley.com/doi/10.1002/jrs.233...

Related URL: http://dx.doi.org/10.1002/jrs.2336

Abstract

The mechanism of the recrystallization in epitaxial (0001) GaN film, introduced by the indentation technique, is probed by lattice dynamic studies using Raman spectroscopy. The recrystallized region is identified by micro-Raman area mapping. 'Pop-in' bursts in loading lines indicate nucleation of dislocations and climb of dislocations. These processes set in plastic motion of lattice atoms under stress field at the center of indentation for the initiation of the recrystallization process. A planar defect migration mechanism is evolved. A pivotal role of vacancy migration is noted, for the first time, as the rate-limiting factor for the dislocation dynamics initiating the recrystallization process in GaN.

Item Type:Article
Source:Copyright of this article belongs to John Wiley and Sons.
Keywords:GaN; Recrystallization; Indentation; Dislocation; Raman Spectroscopy
ID Code:40421
Deposited On:24 May 2011 05:43
Last Modified:17 May 2016 22:30

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