On the low temperature deformation mechanism in polycrystalline cadmium

Sastry, D. H. ; Prasad, Y. V. R. K. ; Vasu, K. L. (1969) On the low temperature deformation mechanism in polycrystalline cadmium Acta Metallurgica, 17 (12). pp. 1453-1457. ISSN 0001-6160

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Official URL: http://linkinghub.elsevier.com/retrieve/pii/000161...

Related URL: http://dx.doi.org/10.1016/0001-6160(69)90009-1

Abstract

The thermally activated plastic flow of polycrystalline cadmium was investigated by differentialstress creep tests at 86°K and tensile tests in the temperature range 86°-473°K. The activation energy (0.55 eV) at zero effective stress and the activation volume as a function of effective stress were obtained. It is concluded that intersection of glide and forest dislocations becomes rate controlling for low temperature deformation. The approximate stacking-fault width in cadmium is deduced to be "1.5b".

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