Thermopower in thin-film copper-Constantan couples

Chopra, K. L. ; Bahl, S. K. ; Randlett, M. R. (1968) Thermopower in thin-film copper-Constantan couples Journal of Applied Physics, 39 (3). pp. 1525-1528. ISSN 0021-8979

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Official URL: http://jap.aip.org/resource/1/japiau/v39/i3/p1525_...

Related URL: http://dx.doi.org/10.1063/1.1656389

Abstract

The thickness dependence of the thermal emf of thin-film copper-constantan thermocouples at room temperature and above shows nearly bulklike behavior when the thickness of both elements comprising the thermocouple is greater than ∼1200 Å. The thermal response time of the thermocouples as measured with a pulsed laser beam heating source is less than 10-6 sec. The thickness-dependent contribution to the thermopower of copper films is deduced from the thermal emf data on thermocouples formed with a thick constantan film and compared with the size-effect theory based on the free-electron model. The marked thickness dependence observed yields anomalously high dependence (an order-of-magnitude higher) of the mean free path on the energy of electrons. This result is tentatively ascribed to the thermopower behavior of a transition layer formed by diffusion of the two components of the thermocouples.

Item Type:Article
Source:Copyright of this article belongs to American Institute of Physics.
ID Code:23196
Deposited On:25 Nov 2010 13:19
Last Modified:28 May 2011 10:23

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