Dynamic recrystallization in high-strain, high-strain-rate plastic deformation of copper

Andrade, U. ; Meyers, M. A. ; Vecchio, K. S. ; Chokshi, Atul Harish (1994) Dynamic recrystallization in high-strain, high-strain-rate plastic deformation of copper Acta Metallurgica et Materialia, 42 (9). pp. 3183-3195. ISSN 0956-7151

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Official URL: http://linkinghub.elsevier.com/retrieve/pii/095671...

Related URL: http://dx.doi.org/10.1016/0956-7151(94)90417-0


When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a microstructure with grain sizes of 0.1 μm can be produced. It is proposed that this microstructure develops by dynamic recrystallization, which is enabled by the adiabatic temperature rise. By schock-loading the material, and thereby increasing its flow stress, the propensity for dynamic recrystallization can be enhanced. The grain size-flow stress relationship observed after cessation of plastic deformation is consistent with the general formulation proposed by Derby [Acta metall. mater.39, 955 (1991)]. The temperatures reached by the specimens during dynamic deformation are calculated from a constitutive equation and are found to be, for the shock-loaded material, in the 500-800 K range; these temperatures are consistent with static annealing experiments on shock-loaded specimens, that show the onset of static recrystallization at 523 K. A possible recrystallization mechanism is described and its effect on the mechanical response of copper is discussed.

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