Kinetics of discontinuous precipitation in a Zn-2.5 at % Cu alloy

Abstract

The morphology and growth kinetics of discontinuous precipitation in a Zn-2.5 at % Cu alloy have been studied in the temperature range 383-583 K by optical and scanning electron microscopy. The precipitate phase has a lamellar morphology, and maintains a statistically constant interlamellar spacing under isothermal growth conditions. The interlamellar spacing increases with an increase in temperature. The isothermal growth kinetics in terms of reaction front migration rate is maximum at 523 K. The upper temperature limit for the occurrence of reaction in this alloy has been predicted to be 643 K. A detailed kinetic analysis of the experimental data using several analytical models has confirmed discontinuous precipitation in this system to be a boundary diffusion controlled reaction, and enabled the determination of the grain boundary chemical diffusivity of Cu in a Zn-rich Zn-Cu alloy in the temperature range studied. The corresponding activation energy values determined in this study, range between 65 to 86 kJ/mol^-1, which compare well with the relevant data in the literature.