Deformation properties of a lead-tin (95–5) solder

Stone, D. ; Wilson, H. ; Subrahmanyan, R. ; Li, Che-Yu (1986) Deformation properties of a lead-tin (95–5) solder MRS Proceedings, 72 . Article ID 175. ISSN 1946-4274

Full text not available from this repository.

Official URL:

Related URL:


Consecutive load relaxation tests are performed on a 95 Pb-5 Sn specimen near room temperature, then at 69 ° C and 1°C. The initial relaxation runs at room temperature show evidence of static recovery, which diminishes after a number of load relaxations have been performed. Evidence of grain boundary sliding is also found. The specimen hardens slowly at 69°C, as manifested by successive load relaxation data falling at lower strain rates. At 1°C, the material slowly softens. These temperature effects are believed to result from a dislocation-solute interaction involving tin atoms in the lead matrix.

Item Type:Article
Source:Copyright of this article belongs to Cambridge University Press.
ID Code:114428
Deposited On:22 May 2018 08:17
Last Modified:22 May 2018 08:17

Repository Staff Only: item control page