Subrahmanyan, Ravichandran ; Stone, Donald ; Li, Che-Yu (1987) Deformation behavior of lLeadless 60% Pb–40% Sn solder joints MRS Online Proceedings Library, 108 . Article ID 381. ISSN 1946-4274
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Official URL: https://www.cambridge.org/core/journals/mrs-online...
Related URL: http://dx.doi.org/10.1557/PROC-108-381
Abstract
Room temperature deformation data of leadless solder joints are reported. The joints were sheared under cyclic, displacement controlled loading at frequencies between 0.001 and 0.01 Hz. A microplastic model was utilized to simulate the stress-strain loops, which demonstrated a pronounced Bauschinger effect. The implications of microplasticity on fatigue life of solder joints are discussed. This phenomenon must be taken into account in an accurate prediction of solder deformation at low strain ranges.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Cambridge University Press. |
| ID Code: | 114426 |
| Deposited On: | 22 May 2018 07:09 |
| Last Modified: | 22 May 2018 07:09 |
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