Carrier, G. ; Francis, G. L. ; Paisley, R. J. ; Subrahmanyan, R. ; Li, C. Y. ; Pence, W. E. ; Krusius, J. P. ; Holleran, L. M. (1989) New TCE-matched glass-ceramic multi-chip module. II. Materials, mechanical and thermal aspects In: 39th Proceedings Electronic Components Conference, 1989, 22-24 May, 1969, Houston, TX, USA.
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Official URL: https://ieeexplore.ieee.org/document/77820/
Related URL: http://dx.doi.org/10.1109/ECC.1989.77820
Abstract
For pt.I see ibid., p.647-51 (1989). A glass-ceramic multichip packaging technology is discussed. The module substrate material is a glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./ degrees C) and possesses a low dielectric constant.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Source: | Copyright of this article belongs to Institute of Electrical and Electronics Engineers. |
| ID Code: | 114425 |
| Deposited On: | 22 May 2018 07:02 |
| Last Modified: | 22 May 2018 07:02 |
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