Comparison of DC and AC NBTI kinetics in RMG Si and SiGe p-FinFETs

Parihar, Narendra ; Southwick, Richard G. ; Sharma, Uma ; Wang, Miaomiao ; Stathis, James H ; Mahapatra, Souvik (2017) Comparison of DC and AC NBTI kinetics in RMG Si and SiGe p-FinFETs In: 2017 IEEE International Conference on Reliability Physics Symposium (IRPS), 2-6 April 2017, Monterey, CA, USA.

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Official URL: http://ieeexplore.ieee.org/abstract/document/79362...

Related URL: http://dx.doi.org/10.1109/IRPS.2017.7936264

Abstract

An ultrafast characterization method is used to study DC and AC NBTI in Si and SiGe channel core RMG p-FinFETs. The time evolution of degradation during and after stress, and the impact of stress bias, temperature, frequency and duty cycle are characterized. A physics-based model is used to qualitatively explain measured data. The similarities and differences of DC and AC NBTI in Si and SiGe channel devices are highlighted.

Item Type:Conference or Workshop Item (Paper)
Source:Copyright of this article belongs to Institute of Electrical and Electronics Engineers.
Keywords:NBTI; Si Channel; SiGe Channel; RMG FinFETs
ID Code:112559
Deposited On:09 Apr 2018 11:27
Last Modified:09 Apr 2018 11:27

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