Tri-Level resistive switching in metal-nanocrystal-based Al2O3/SiO2 gate stack

Chen, Y. N. ; Pey, K. L. ; Goh, K. E. J. ; Lwin, Z. Z. ; Singh, P. K. ; Mahapatra, S. (2010) Tri-Level resistive switching in metal-nanocrystal-based Al2O3/SiO2 gate stack IEEE Transactions on Electron Devices, 57 (11). pp. 3001-3005. ISSN 0018-9383

Full text not available from this repository.

Official URL: http://ieeexplore.ieee.org/document/5570936/

Related URL: http://dx.doi.org/10.1109/TED.2010.2070801

Abstract

Tri-level resistive switching behavior was observed in an Al2O3/SiO2gate stack with Ru metal nanocrystals embedded in the Al2O3 layer. The device was successfully switched among three resistance states (high, medium and low) after a forming process using a simple electrical method. The resistance ratio of the high-resistance state to the low-resistance state is more than 103. The insulator-to-conductor (and vice versa) transition of the Al2O3 and SiO2 dielectric layers is elucidated by a physical model, which invokes oxygen ion (O2-) trapping/detrapping at the metal-oxide interfaces, as well as O2- transport and annihilation with the oxygen vacancies in the breakdown percolation path. The switching transition of each individual dielectric layer is found to be dependent on the polarity of the gate bias. This new understanding opens the prospect of metal-nanocrystal-based Al2O3/SiO2 gate stacks for a resistive switching memory application.

Item Type:Article
Source:Copyright of this article belongs toInstitute of Electrical and Electronic Engineers.
Keywords:Resistive Switching; Dielectric Breakdown; Metal Nanocrystal (MNC); Percolation Path
ID Code:112539
Deposited On:02 Apr 2018 08:44
Last Modified:02 Apr 2018 08:44

Repository Staff Only: item control page