Palladium thiolate bonding of carbon nanotube thermal interfaces

Hodson, Stephen L. ; Bhuvana, Thiruvelu ; Cola, Baratunde A. ; Xu, Xianfan ; Kulkarni, G. U. ; Fisher, Timothy S. (2011) Palladium thiolate bonding of carbon nanotube thermal interfaces Journal of Electronic Packaging, 133 (2). Article ID 020907, 6 pages. ISSN 1043-7398

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Official URL: http://electronicpackaging.asmedigitalcollection.a...

Related URL: http://dx.doi.org/10.1115/1.4004094

Abstract

Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16H35)2, to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.

Item Type:Article
Source:Copyright of this article belongs to The American Society of Mechanical Engineers.
Keywords:Carbon Nanotubes; Nanoparticles; Palladium; Bonding; Temperature
ID Code:102822
Deposited On:22 Mar 2017 08:52
Last Modified:22 Mar 2017 08:52

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