Kottada, Ravi S. ; Chokshi, Atul Harish (2005) Low temperature compressive creep in electrodeposited nanocrystalline nickel Scripta Materialia, 53 (8). pp. 887-892. ISSN 1359-6462
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Official URL: http://linkinghub.elsevier.com/retrieve/pii/S13596...
Related URL: http://dx.doi.org/10.1016/j.scriptamat.2005.06.035
Abstract
Steady state creep was not observed during large strain compressive creep in electrodeposited nanocrystalline-Ni. An additional exothermic peak during differential scanning calorimetry of deformed samples is attributed to recovery associated with geometrically necessary dislocations. The lack of change in texture suggests that grain boundary sliding and rotation occurred during creep.
| Item Type: | Article |
|---|---|
| Source: | Copyright of this article belongs to Acta Materialia Inc. |
| Keywords: | Nanocrystalline; Nickel; Creep; Dislocation; Diffusion |
| ID Code: | 22418 |
| Deposited On: | 25 Nov 2010 14:04 |
| Last Modified: | 03 Feb 2011 12:06 |
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