Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

Bhuvana, Thiruvelu ; Smith, Kyle C. ; Fisher, Timothy S. ; Kulkarni, Giridhar U. (2009) Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder Nanoscale, 1 (2). pp. 271-275. ISSN 2040-3364

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Official URL: http://pubs.rsc.org/en/Content/ArticleLanding/2009...

Related URL: http://dx.doi.org/10.1039/B9NR00035F

Abstract

An easy and elegant method of CNT nanocircuit fabrication using a metal organic precursor of Pd, namely, Pd hexadecanethiolate, is presented. This precursor directs the self-assembly of individual CNTs spanning a gap between Au electrodes. This is achieved by first patterning the precursor along the edges of the gap electrodes, as it enables direct patterning by e beam. Further, thermal activation of the precursor at 250 °C leads to metallization and the ohmic electrical contact between the CNTs and the electrodes beneath. A resistive fuse action of the soldered CNTs is observed as well.

Item Type:Article
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